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US Patent Issued to MACOM TECHNOLOGY SOLUTIONS HOLDINGS on July 21 for "Metal pillar connection topologies for heterogeneous packaging" (North Carolina, California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,254, issued on July 21, was assigned to MACOM TECHNOLOGY SOLUTIONS HOLDINGS INC. (Lowell, Mass.). "Metal pillar connection topologies for h... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor device sidewall of the gate semiconductor layer including a plurality of surfaces having different slopes" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,255, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device sidewall of the gate... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on July 21 for "Semiconductor device with capping layer and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,256, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with capping layer and meth... और पढ़ें


US Patent Issued to Intel on July 21 for "Stacked source or drain contact flyover" (Oregon Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,257, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Stacked source or drain contact flyover" was invented by Sukru ... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Dipole patterning for CMOS devices" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,258, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Dipole patterning for CMOS devices"... और पढ़ें


US Patent Issued to Tokyo Electron on July 21 for "Device and method of forming 3D U-shaped nanosheet cfet" (Florida, Texas Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,259, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Device and method of forming 3D U-shaped nanosheet cfet" was invented... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Leakage reduction methods and structures thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,260, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Leakage reduction methods and struc... और पढ़ें


US Patent Issued to Imec vzw on July 21 for "Integrated circuit chips comprising forksheet devices connected with buried power rails" (Belgian Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,261, issued on July 21, was assigned to Imec vzw (Leuven, Belgium). "Integrated circuit chips comprising forksheet devices connected with b... और पढ़ें


US Patent Issued to DENSO on July 21 for "Semiconductor device having drive circuit configured to output voltages applied to plurality of gate electrodes" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,262, issued on July 21, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device having drive circuit configured to output v... और पढ़ें


US Patent Issued to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL on July 21 for "Dual p-body dose reverse-conducting (DPD-RC) IGBT structure" (California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,263, issued on July 21, was assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto). "Dual p-body dose reverse-conducting (DPD... और पढ़ें